Headset

Headset Application Point

Model of application products

Application Glue Model Characteristic
Infrared light pipe γ>&bonding PUR, UV JT8011S4, JT6080/JT6227 High bond strength, no €≠ stickiness
Vent Bonding UV/UV+Moisture JT6039/JT6065A High bond strength, good drop resista↔±nce
Membrane + Coil UV JT6001-3/6227/6069/64‌∞81 Good moisture resistan×<"ce, can bond a variety of films
Membrane + Dome UV JT6220 Low shrinkage, high bond strengt$♣¶γh
Membrane + stent UV JT6039 Optimized for PPA shells, high bond st€≥€←rength
Magnetic + pole piece Anaerobic JT3306/JT3310 High bond strength to metal
Magnetic bonding Anaerobic, epoxy JT3306/JT3310, JT5102/J♦λT5102N Excellent drop resistance,ε↓✘ high bond strength
Bracket bonding PUR JT8011S4/JT8020 Excellent anti-aging properti≠>es, high bond strength
Bottom padding epoxy JT5801 Compatible with most l>™₽≥ead-free solders, good flow
Force sensor BTB waterpro©♠↓of UV JT6040/JT6040S high bond strength
Shell bonding PUR JT8008SL/JT8013S3 High bond strength, good che"♣mical resistance
Battery holder bonding<σ PUR, UV JT8011S4, JT6039/JT6065A High bond strength, monomers of©∞"• no concern
Battery Solder Joint Protection UV JT6074/JT6062/JT6452R Good electrical cond±​¥uctivity, easy to bend
PCBA Nanocoating ProtectΩ≤γ'ion Nanocoating JT4701 Excellent water and cλ&¶≤hemical resistance
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