Low-temperature epoxy is on×★®e-component low-tempera∏←"↑ture curing epoxy adhesive. It can be±← used in automatic line prod★≤uction with the good performan↕Ω♥πce of fast-cure and drop resist♣γ₩ance. It is mainly used for bonding, ∞γreinforcement and compo¥γnent protection of electroni™♠>♠c parts. The productsδπ↑ are widely used in camera€"< module, fingerprint module, s∑÷©∞peaker, receiver, motor, militaryφ ← headset, PCBA, FPC and ot ÷her products.
● Customized according to spec₩&↑★ific needs;
● Fast-cure, suitable for auβ$₩♠tomatic line production;
● Low-temperature cure, Fast-cure;
● Good Toughness, Excellent dr≠∑op resistance;
● Excellent thermal shock perfor< ®φmance, High temperature and humidi'÷∑ty resistance;
● Meet EU environment proσ →≤tection requirements,∑↔γ ROHS, Reach, Halogen-free, O-benzene-× αfree, Organotin-free.
| Item | Color | Viscosity (cps/25°C) |
Cure condition | Hardness (shore D) |
Shear strength (MPa, steel/steel) |
Rate of contraction (%) |
Elongation (%) |
|---|---|---|---|---|---|---|---|
| 5100-3 | black | 3000 | 80°C30min | 80 | 20.6 | 0.15 | 2.3 |
| 5213 | black | 4000 | 120°C20min | 80 | 23.6 | 0.16 | 2.8 |
| 5211 | black/white | 12000 | 90°C30min | 79 | 17.2 | 0.5 | 18.1 |
| 5231 | blue | 5220 | 100°C30min | 81 | 21.6 | 0.55 | 15.3 |
| 5221 | black/white | 12400 | 100°C1h | 79 | 20.7 | 0.5 | 12.6 |
