Low-temperature epoxy is one-✘←component low-temperature cu♦∑ring epoxy adhesive. It can be used≥& in automatic line produc≤®tion with the good pe↑♥rformance of fast-cure and drop ★±resistance. It is mainly used for boπ•βnding, reinforcement and cδ×omponent protection →>>of electronic parts. T₽®✔he products are widely used<∑ in camera module, fingerprin∑€t module, speaker, receiver, mot★Ω♦or, military headset, PCBA, FPC and oth←φer products.
● Customized accordin≈g to specific needs;
● Fast-cure, suitable fo✘"<r automatic line production;
● Low-temperature cu≈$∞re, Fast-cure;
● Good Toughness, Excellent drop res€"§♦istance;
● Excellent thermal shock •↓↑performance, High temperature and hum₽&idity resistance;
● Meet EU environment protection r✔ $<equirements, ROHS, Reach↔₩, Halogen-free, O-benzene-↕×✔free, Organotin-free.
| Item | Color | Viscosity (cps/25°C) |
Cure condition | Hardness (shore D) |
Shear strength (MPa, steel/steel) |
Rate of contraction (%) |
Elongation (%) |
|---|---|---|---|---|---|---|---|
| 5100-3 | black | 3000 | 80°C30min | 80 | 20.6 | 0.15 | 2.3 |
| 5213 | black | 4000 | 120°C20min | 80 | 23.6 | 0.16 | 2.8 |
| 5211 | black/white | 12000 | 90°C30min | 79 | 17.2 | 0.5 | 18.1 |
| 5231 | blue | 5220 | 100°C30min | 81 | 21.6 | 0.55 | 15.3 |
| 5221 | black/white | 12400 | 100°C1h | 79 | 20.7 | 0.5 | 12.6 |
