Smartphone

Smartphone application poin∏ ¥t

Model of application product≠>s

Application Glue Model Characteristic
Display screen LCM frame protection PUR, MMA JT8402B/JT6710 Excellent shading ability, high bond σ≈πstrength
FPC bonding UV JT6052R Corrosion resistant, high ​ ₽™viscosity product
Camera module Shell bonding UV thermosetting JT6301B UV light/heat curing, low curing shrink&♥¶age
Bracket bonding epoxy JT5113S3 Fast curing at low tempera​¶÷¥ture, low glue precipitation ra♥ε∏te
lens bonding UV JT6455S1 High bonding strength to LCP/PPAδ₽★ , excellent anti-aging ability
Coil Bonding epoxy JT5308 Excellent drop resistance and high bond↑Ω€ strength
Speaker/Handset cover bonding PUR JT8020-5 High bond strength to nicke©ε"l, high temperature creep resisγ ↓tance
magnetic bonding Anaerobic JT3310/JT3267 High bond strength to zinc × ♣and nickel, excellent  ☆¶÷aging resistance
Sound membrane + dome UV JT6220 Good long-term heat res↕β≈istance, high bond strengt↕♥h to film
Sound film + coil UV JT6227 High bond strength to PEEK/TPU×≤↔€/TPE, good long-term heat res§φ☆↑istance
Vibrator cover bonding PUR JT8008SL/JT8013S3 High bond strength, lπ®"ow cure shrinkage
magnetic bonding Anaerobic JT3310/JT3267 High bond strength to zinc and nickel, α÷excellent aging resistance
Border bonding battery cover bonding PUR JT8148S6B Reworkable, good viscosi♣‌← ty stability at 110ºC
TP bonding PUR JT8142B High bonding strength§£γ↔ to glass and PC/GF, exce♣δ×←llent impact resistance
Battery Solder joint protection UV JT6452 Corrosion resistant, high♦$ ↑ viscosity product
Thermal Conductivity Silica gel JT1201 High thermal conductivity (~5W/m&mi←±ddot;K), low tempera™↕ ture curing
Fingerprint lock ring bonding epoxy JT5811S7 High bond strength, low cure shrinkag§ →e, low water absorptioσ n
bottom padding epoxy JT5801 Good flow at room temperatur$↔★≈e, compatible with most leα¥€ad-free solders
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